A monolithic semiconductor substrate

Chip Design Journal

Subscribe to Chip Design Journal: eMailAlertsEmail Alerts newslettersWeekly Newsletters
Get Chip Design Journal: homepageHomepage mobileMobile rssRSS facebookFacebook twitterTwitter linkedinLinkedIn


Chip Design Authors: Jason Bloomberg, Trevor Bradley, David Strom

Related Topics: Chip Design

Chip Design: News Feed Item

Event Advisory: Applied Materials Hosts Forum to Explore Emerging Lithography Technologies

Without robust and affordable next-generation lithography, the current semiconductor roadmap could change dramatically. For 22nm and beyond, patterning candidates such as EUVL*, nano-imprint, direct write and optical double patterning methods show promise. But which one will deliver the best balance of performance and cost? On February 25, in San Jose, California, Applied Materials will host an important seminar exploring this critical topic.

Titled “Next Generation Lithography Technologies: Yielding Moore with Less,” the forum will be led by Dr. Hans Stork, chief technology officer of Applied Materials’ Silicon Systems Group. The program will feature an afternoon of technical presentations discussing new patterning, inspection and metrology techniques and their influence on lithography. The presentations will be followed by an exploratory look into the world of 22nm chip design with a live demonstration of decomposition tools for 22nm sidewall spacer double patterning. Experts drawn from academia; circuit design; and logic, memory and foundry manufacturing will round out the program with a spirited debate on lithography technology for the future.

Panel:       Jongwook Kye – AMD, Inc.

Burn Lin – TSMC, Ltd.

Steve Radigan – SanDisk Corporation

Milind Weling – Cadence Design Systems, Inc.

Grant Willson – University of Texas at Austin

Ken MacWilliams – Applied Materials, Moderator

 
Where: The Sainte Claire Hotel,
302 S Market Street, San Jose, CA 95113
 
When: Wednesday, February 25, 2009
 
Schedule: 3:00pm-3:30pm         Registration
3:30pm-5:00pm Seminar program
5:00pm-5:30pm Live demonstration of 22nm sidewall spacer design software
5:30pm-6:45pm Panel discussion
6:45pm-8:30pm Reception

For more information on this compelling event, please visit www.appliedmaterials.com/2009_SPIE.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live. Learn more at www.appliedmaterials.com.

*EUVL = extreme ultraviolet lithography

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.