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Chip Design Authors: Jason Bloomberg, Trevor Bradley, David Strom

Related Topics: CEOs in Technology, Consumer Electronics, Chip Design, Aerospace Journal, Market Research, CES 2010 on Ulitzer, Government Cyber Assurance

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BroadPak Introduces Semiconductor Industry’s First Tamper-Resistant and Security-Enabled 2.5D/3D Packaging Technology

BroadPak, the leading provider of 2.5D/3D integration technologies and comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products.

This breakthrough technology prevents reverse engineering of the 2.5D/3D packages and blocks unauthorized access to confidential data. It leverages BroadPak’s universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production.

A report released in January 2014 by the World Economic Forum in collaboration with McKinsey & Company concluded that delays in adopting cyber security capabilities could result in a US$ 3 trillion loss in economic value by 2020. In addition, the 2.5D/3D market is expected to grow 88% by 2017 according to a report by Yole Development market research firm. Also, semiconductor chips are becoming increasingly susceptible to malicious alteration due to globalization of chip design and manufacturing processes. In response to these industry trends, BroadPak has developed this new technology which enables companies to have access to fully secured and tamper-resistant 2.5D/3D package in high volume manufacturing.

"Rising threat to global electronic security has created an urgent need for fully secured and tamper-resistant electronics infrastructure. Given the breath and magnitude of this security challenge, BroadPak has made a significant investment in developing the next generation of secured 2.5D/3D packaging technologies to serve as a foundation for future semiconductor product development," said Farhang Yazdani, President and CEO of BroadPak. "This breakthrough technology can serve a wide variety of markets such as medical, defense, aerospace, financial, enterprise, etc. This will help to proliferate secured 2.5D/3D products worldwide and would greatly benefit both the industry and the consumers."

More Information

Customers interested in more information can contact BroadPak at +1 (408) 922-9006, (e-mail: [email protected]).

About BroadPak

BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions. BroadPak’s mission is to enable and accelerate the development and commercialization of green semiconductor products and IPs. BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs. The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients. BroadPak supports global clients in networking, communications, medical, aerospace, defense, and consumer electronics. www.broadpak.com

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