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Chip Design Journal

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Chip Design Authors: Jnan Dash, Jason Bloomberg, Trevor Bradley, David Strom

Related Topics: Datacenter Automation, Chip Design, Telecom Innovation

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SpringSoft Showcases Latest Generation Chip Design Solutions at TSMC OIP Ecosystem Forum

SpringSoft, Inc., a global supplier of specialized IC design software, will showcase the latest generation of its popular Laker custom IC design and layout product family at the TSMC Open Innovation Platform Ecosystem Forum on October 16, 2012 at the San Jose Convention Center, in San Jose, California. The company will offer software demonstrations and a featured technical presentation on the latest chip design automation innovations and optimized tool flows aimed at addressing 20nm custom design challenges.

SpringSoft technology experts in Booth #104 will highlight the new Laker3™ Custom IC Design Platform that provides a complete OpenAccess (OA) design and layout environment optimized for performance and interoperability in 20-nanometer (nm) custom digital, analog and mixed-signal flows. Key advancements include new double patterning-aware design and voltage-dependent design rule checking (VDRC) flows, enhanced flows for layout-dependent effect (LDE) and parasitic-aware layout, and advanced gradient density analysis capabilities.

SpringSoft’s presentation on October 16th at 1:30 pm entitled “Enabling 20nm Custom Design in Lakerwill reinforce the company’s commitment to the TSMC Open Innovation Platform with an open, interoperable custom design system built on the OA database that enables integration with TSMC application programming interfaces (APIs) and third-party EDA solutions to provide a comprehensive 20nm infrastructure. Specifically, it will discuss in detail the collaboration by SpringSoft and TSMC on key solutions for the recently announced TSMC Custom Design Reference Flow. For more information, visit: http://www.springsoft.com/news-events/events/tsmc-2012-open-innovation-platform®-ecosystem-foru.

About SpringSoft

SpringSoft, Inc. (TAIEX: 2473) is a global supplier of innovative automation technologies for the design and verification of complex digital, analog and mixed-signal SoCs. Its award-winning product portfolio is used by more than 400 of today's leading semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.

Laker and Laker3 are trademarks of SpringSoft, Inc. All other trademarks or registered trademarks are the property of their respective owners.

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