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Chip Design Authors: Jason Bloomberg, Trevor Bradley, David Strom

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Chip Design: Article

Silicon Laboratories Deploys CEVA-Teak in GSM/GPRS Phone Chips

AeroFone Utilizes Superior Power to Perform Integrated Baseband Processing

“The combination of CEVA’s proven expertise in delivering high-performance, industry-leading DSP cores along with Silicon Laboratories’ excellent track record in developing leading-edge handset technologies like AeroFONE, resulted in the creation of a truly unique offering for the handset market,” said Gideon Wertheizer, CEO of CEVA. “This latest deployment of our CEVA-Teak DSP core further demonstrates the continued adoption of CEVA’s technologies by leading semiconductor companies and underlines our position as the industry’s leading licensor of DSP cores for wireless communications.”
 
CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture features high-performance, high flexibility and throughput for complex Digital Signal Processing implementations. The core is designed for low-power, speech and audio processing, multimedia and wireless communications (GSM, CDMA, EDGE, 3G, etc.), high-speed modems, advanced telecommunication systems, and various embedded control applications. CEVA-Teak is designed with consideration for low-power uses to achieve the best possible performance with the lowest possible power consumption. It makes the core suitable to a wide variety of battery-powered portable applications.

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Most Recent Comments
Wireless Business & Technology Magazine 11/01/05 02:57:43 PM EST

Silicon Laboratories Deploys CEVA-Teak in GSM/GPRS Phone Chips. CEVA has announced that Silicon Laboratories has licensed and deployed the CEVA-Teak DSP core in the AeroFONE single-chip phone, an integrated, high performance, easy-to-use solution for GSM/GPRS handsets.

Peter North 11/01/05 02:43:21 PM EST

How about CDMA phones?