A monolithic semiconductor substrate

Chip Design Journal

Subscribe to Chip Design Journal: eMailAlertsEmail Alerts newslettersWeekly Newsletters
Get Chip Design Journal: homepageHomepage mobileMobile rssRSS facebookFacebook twitterTwitter linkedinLinkedIn

Chip Design Authors: Jnan Dash, Jason Bloomberg, Trevor Bradley, David Strom

Related Topics: 3G Innovations, Chip Design, Market Research

News Feed Item

QuickLogic CSSP Adds Additional Capability to Icera’s Espresso® 300 3G Soft Modem Solution for Rapidly Growing USB Modem Market

QuickLogic Corporation (NASDAQ: QUIK), the lowest power programmable solutions leader, today announced the selection of its Customer Specific Standard Product (CSSP), based on the ArcticLink solution platform, for the Icera Espresso® 300 3G soft modem platform, that is now entering production.

Icera is a leader in software-defined wireless chipsets and is the only company to deliver software-based cellular modems for broadband data cards, USB sticks, and mobile internet devices. Icera’s reference design uses a wafer-level chip scale (WLCSP) version of the ArcticLink solution platform to compliment its second-generation baseband chip design. QuickLogic provides higher speed, smart data transfers between USB and SD/SDHC memory via QuickLogic’s innovative Smart Programmable Integrated Data Aggregator (SPIDA) system block.

Mobile data service providers anticipate customer demand for USB-based broadband data cards to reach nearly 40 million units in 2009, according to the market research firm ABI Research. By working with QuickLogic, Icera was able to rapidly address the emerging market for USB data cards that incorporate a micro SD/SDHC memory card interface. By using the QuickLogic CSSP, based on the ArcticLink solution platform, Icera was able to quickly adapt their leading edge USB data card reference design, without compromising power consumption or impacting performance – in terms of both the modem and the USB-to-SD/SDHC memory transfers. As a result, consumers can now have one USB device plugged into their PC, incorporating both a cellular modem and removable memory function.

“QuickLogic’s technology and capabilities were key to our ability to quickly respond to the shifting market requirements without compromises,” said Rick Dingle, vice president of Customer Engineering at Icera. “The CSSP approach and the use of QuickLogic’s SPIDA-proven system block embedded within the ArcticLink solution platform provided us with the opportunity to work with QuickLogic on architecting and adapting the solution for power and performance efficiencies. By working directly with QuickLogic’s architecture and development teams, Icera was able to go from specification to first samples in less than eight weeks.”

“QuickLogic’s CSSP solutions provide innovative companies such as Icera with the flexibility to implement custom designs optimized for power consumption and performance while saving them the time, expense and effort of spinning base platform silicon,” said Andrew J. Pease, QuickLogic’s president. “Because CSSPs are not customized until after fabrication and test, we have an appropriate die bank awaiting the needs of many different customers, giving them customized solutions at standard product pricing and availability.”

The ArcticLink-based CSSP that Icera chose belongs to a family of solution platforms that embed a unique combination of QuickLogic’s patented ViaLink® programmable fabric technology and hard-wired logic for commonly requested functions to maximize speed, and minimize power consumption and cost. QuickLogic implemented additional proven system blocks (PSBs) with state-of-the-art power consumption and performance characteristics in the programmable fabric to meet specific customer requirements. This breadth of functions gives customers the ability to quickly receive a customer specific design with the right combination of functionality, performance, size, and cost without the delays and expense that characterize other custom design approaches.

About QuickLogic

QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.

About Icera

Icera is a fabless semiconductor company, pioneering high performance, low power, soft modem chipsets for the fast growing mobile broadband device market. Icera technology delivers the highest performance modem solutions for USB dongles, datacards, laptops, mobile internet devices and smartphones. Founded in 2002, Icera is headquartered in the UK, with design locations in the UK, France and North America, with customer engineering and sales offices in Europe, Asia and the USA. For more information, visit the Icera web site at www.icerasemi.com.

The QuickLogic name, ViaLink and ArcticLink are registered trademarks of and the QuickLogic logo is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.

Code: QUIK-G

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.