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Chip Design Authors: Jason Bloomberg, Trevor Bradley, David Strom

Related Topics: Datacenter Automation, Chip Design

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Apache Design Solutions to Host Customer Presentations and Hands-On Tutorials at Design Automation Conference

In booth #722 at the 46th Design Automation Conference (DAC) in San Francisco CA, Apache Design Solutions, the technology leader in power and noise integrity for chip, package, system (CPS) convergence, will host presentations by leading semiconductor companies on their methodologies for addressing power and noise challenges and their experiences with Apache’s tools. The company will demonstrate recently announced Totem power, noise, and reliability platform for analog, mixed-signal, memory, and high-speed I/O designs, as well as RedHawk-NX, the industry’s leading next generation SoC power integrity solution and Sentinel, a chip-package-system co-analysis and co-optimization solution for IC package, board, and SiP designs. In addition, hands-on tutorial sessions will be conducted to provide first-hand experience with Totem and RedHawk. For presentation details and registration, go to http://www.apache-da.com/apache-da/Home/NewsandEvents/Seminars.html.

WHAT:

  Customer presentations; product and technology roadmap presentations; hands-on tutorial sessions
 

WHERE:

Apache Design Solutions, Booth #722, South Hall
Design Automation Conference, Moscone Convention Center, San Francisco CA
 

WHEN:

Rambus: High-speed I/O interface supply noise and reliability analysis
Monday, July 27, 1:00 p.m.
 
TSMC: SiP opportunities and design challenges
Tuesday, July 28, 11:00 a.m.
 
Broadcom: Prototyping to sign-off of 45nm Broadcom Mobility Chip design
Tuesday, July 28, 1:00 p.m.
 
Totem Hands-on Tutorial
Monday, July 27, 3:00 p.m.
 
RedHawk Hands-on Tutorial
Tuesday, July 28, 3:00 p.m.
 
RedHawk, Totem, and Sentinel presentation and demonstration
July 27 – July 29, 10:00 a.m. – 6:00 p.m.
July 30, 10:00 a.m. – 1:00 p.m.

Additional Presentations at DAC by Apache Design Solutions:

In the Exhibitor Forum (booth #4359), Apache Design Solutions will be presenting “De-Risking Your Design from Power Noise Impact” on July 27 at 2:00 p.m. and “Power and Substrate Noise Analysis and Design Optimization for High-performance Analog and Custom Design” on July 29 at 1:00 p.m.

About Apache Design Solutions

Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache's innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog and custom IP, and System (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by over 100 customers including 90% of the top IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 150 employees and R&D centers and direct sales / support offices worldwide. For more information, visit www.apache-da.com.

Apache Design Solutions, CMM, CPM, NSPICE, RedHawk, PakSI-E, PsiWinder, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.

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