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Analog & Mixed-Signal Expert Named Strategy Director of Dongbu HiTek’s Analog Foundry Business Unit

Intensifying its focus on analog foundry processing capabilities, Dongbu HiTek’s Semiconductor Division today announced that Felicia James has joined the company as Strategy Director of its Analog Foundry Business Unit (AFBU), a new position reporting to Lou N. Hutter, SVP and GM of the Unit. The Korean foundry’s recruitment of Ms. James, a widely recognized analog and mixed-signal expert, closely follows appointments of four other chip industry veterans, namely, Dr. Badih El-Kareh, Dr. Howard R. Test, Mr. Toshiaki Taniguchi and Mr. Yoichi Okumura.

According to Mr. Hutter, Dongbu HiTek’s AFBU currently serves some 30 customers worldwide, including Analog Devices, Sanken and Silicon Mitus to name a few. The Unit continues to demonstrate exceptional quality and reliability in implementing analog intensive chips that enable power management (PMIC), LED driver (LDI), DC/DC converter, data inverter, motor driver and audio amplifier applications. He noted that the AFBU is still recruiting industry veterans, and that it is currently interviewing seasoned analog technology professionals to fill the Unit’s Quality & Reliability Analysis function.

“Our Analog Foundry Business Unit continues to attract some of the most talented and experienced analog and mixed-signal professionals in the business,” said Mr. Hutter. “We look forward to Ms. James applying the full measure of her product development and management skills to strengthen both our supply chain infrastructure and strategic 3rd party relationships.” He cited Ms. James as a “significant” addition to Dongbu HiTek’s AFBU, which aspires to become the most respected and most competitive analog foundry in the industry, adding, “The collective analog and mixed-signal experience of our team is awesome!”

Following are brief bios of the AFBU’s rapidly expanding team:

Felicia James, Strategy Director, Dallas, TX

During her 27 years working with semiconductor design and processing technologies, Ms. James has held senior management posts at several major companies. She was previously the VP of Business Development for Microtech Labs, an analytical lab specializing in analog product failure analysis. Prior to this, she worked for five years as a VP for Cadence Systems, responsible for its Custom IC Business Unit and 3rd Party Design Kits business. Earlier in her career, she worked at Texas Instruments over an 18-year period during which she distinguished herself in a number of key positions in Product Engineering, IC Design, and EDA. Widely recognized as an industry expert in the area of mixed-signal IC product development, Ms. James holds a BSEE from the University of Virginia.

Dr. Badih El-Kareh, Device Engineering, Dallas, TX

Adding more than 40 years’ chip technology experience to Dongbu HiTek, Dr. El-Kareh recently developed, together with a cross-functional team at Texas Instruments, advanced CMOS and SiGe BiCMOS technologies that address both precision analog and high-voltage applications. During his nine years with TI, he had 6 patents issued and 9 disclosures filed, and won May 2003 recognition as “Innovator of the Year” by EDN magazine for his work in BiCMOS technology. Earlier in his career, he held key technology positions at IBM over his 23-year tenure, during which he had 25 patents issued and 65 invention disclosures. Dr. El Kareh earned his Ph.D. in Physics at the University of Stuttgart in Germany where he was also a Post-doctorate fellow.

Dr. Howard R. Test, Technical Consulting, Dallas, TX

With more than 40 years’ semiconductor industry experience, Dr. Test has expertise in materials, processes and failure analysis as well as packaging and testing. As a major project manager and individual technical contributor, he has led design definition and process development for implementing thick copper interconnects. Prior to joining Dongbu HiTek, he served as an Engineering Manager at Texas Instruments, where he was instrumental in developing wire bond processes for low-k dielectric chips. Holding 14 patents in semiconductor packaging, he earned both Ph.D. and Master’s Degrees in Physics from Texas University.

Toshiaki Taniguchi, Analog Foundry Sales, Japan

Mr. Taniguchi brings 40 years of sales/marketing experience to Dongbu HiTek, having served most recently as GM of Sales & Marketing for Nippon Denso Ind. Co., Ltd., one of Dongbu HiTek’s distributors. During his nine-year tenure with Freescale Semiconductor (formerly Motorola Semiconductor), he served in a number of key sales, marketing and customer service positions, the most recent being Manager of Customer Satisfaction for the Automotive Group. With demonstrated skills in building customer relationships, Mr. Taniguchi has extensive knowledge of Japanese semiconductor market and its key players as well a global distribution channels.

Yoichi Okumura, Analog Foundry Marketing, Japan

A seasoned chip designer, Mr. Okumura has logged 32 years’ experience working with advanced processes such as HVCMOS, BiCMOS and Bipolar as well as design disciplines encompassing component engineering, design flow, simulation, test chip layout, device characterization and design rule setup. He comes to Dongbu HiTek from Universal Device Technology Co. Ltd. (Tokyo) where he focused on analog chip design. His distinguished design and project management career spans nine years with Texas Instrument, and before this, eight years with NEC IC Microcomputer System Ltd. He earned his Bachelor of Electronic Engineering from Nippon University in Tokyo.

About Dongbu HiTek

With headquarters in Seoul Korea, Dongbu HiTek Co., Ltd. (KRX:000990) offers advanced products and services across two major business domains: Agriculture and Semiconductor. The Semiconductor Business provides specialized chip processing services. The company’s two world-class fabs currently process 200mm (8-inch) wafers at nodes ranging from 0.35 microns to 90 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development/verification, and packaging/module development. For more information, visit www.dongbuhitek.com.

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