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Chip Design Journal

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AT DAC BOOTH #530
DESIGN AUTOMATION CONFERENCE –– Chip Path Design Systems, the system-on-chip assembly company, today announced that it will be showing a new system-on-chip (SoC) and application-specific integrated circuit (ASIC) architectural assembly and floorplanning syst...
EVE, the leader in hardware/software co-verification, today announced they have joined forces with Spirent Communications, the leader in testing Ethernet and wireless networks, devices and services, to integrate EVE's ZeBu system-on-chip (SoC) hardware-assisted verification platform wi...
Mentor Graphics Corp. (NASDAQ: MENT) announced support for the newly approved Accellera Systems Initiative Unified Coverage Interoperability Standard (UCIS) version 1.0 via the Questa® UCIS API library. Mentor made the original donation of the Questa ...
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its collaboration with TSMC on 3D-IC design infrastructure development.
ATopTech, the leader in next-generation physical design solutions that address the challenges of designing integrated circuits (ICs), announced today that it has received TSMC Phase I Certification for its Aprisa™ place and route technology.
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it has contributed to STMicroelectronics having taped out a 20-nanometer test chip, incorporating custom analog and digital methodologies to enable mixed-signal SoC design...
AT DAC BOOTH #530
Open Core Protocol International Partnership (OCP-IP) announces the availability of a new OCP book titled “Introduction to Open Core Protocol: Fastpath to System-On-Chip Design.” The book provides a hands-on, how-to guide for semiconductor design. Its compre...
SpringSoft, Inc., a global supplier of specialized IC design software, today is hosting a series of activities at 49th Design Automation Conference (DAC) in San Francisco, Calif., starting June 4 through June 6, 2012, that feature the next-generation ...
Seven companies will be demonstrating significant progress advancing design flow interoperability in the Silicon Integration Initiative (Si2) Booth #1214 at the Design Automation Conference on June 4-6, at the Moscone Center in San Francisco, CA. These compa...
HP (NYSE: HPQ) today announced powerful business products packed with energy-efficiency, security and performance features designed to meet customer needs across industries such as healthcare, retail, and media and entertainment.
S3 Group today announced that it has partnered with Cognovo to provide System-on-Chip (SoC) design services alongside Cognovo’s Modem Compute Engine IP for Software Defined Modem in order to accelerate time to market. S3 Group initially collaborated w...
HD-PLC Alliance announced that at least four alliance member companies have completed or are working on HD-PLC LSI chip design. Panasonic supplied the 2nd generation 210Mbps HD-PLC LSI chip that is widely adopted in the Asian market. This February, Kawasaki ...
- All-New Chip Specifically Developed For Screens Up To 20 Feet Wide; Provides Exhibitors With Another High Quality, Reliable Solution To Go Digital
Tensilica®, Inc. today announced that it has moved its research and development center in Pune, India, to a new building, doubling the space previously available. Tensilica plans to increase headcount by at least 50 percent in the next year. Over the past six years, employees at Tensil...
Cypress Semiconductor Corp. (Nasdaq: CY) today announced that Norm Taffe, EVP of the Consumer and Computation Division (CCD), will be leaving the company this summer to pursue a start-up business opportunity outside of the electronics industry. He will be re...
NEW YORK, April 11, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
Oasys Design Systems, a provider of chip design software, today announced it has closed Series B Funding with investments from Intel Capital, Intel's global investment organization, and Xilinx, a leading provider of programmable platforms. Funding will be used as working capital to exp...
NEW YORK, April 5, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
A cheaper, faster and more efficient platform for preclinical drug discovery applications has been invented by scientists at the Institute of Bioengineering and Nanotechnology (IBN), the world's first bioengineering and nanotechnology research institute. Called 'Fish and Chips', the no...
Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that its XPM (eXtra Permanent Memory) IP is integrated into a Set-Top Box (STB) SoC being designed by SICMICRO (Chongqing Silian Microelectronics Co...
Memoir Systems Inc., the Semiconductor Intellectual Property (SIP) provider that delivers breakthrough embedded memory performance, today announced the availability of its first commercial product family: Renaissance™ 2X. Based upon the company’s awar...
As one of China’s key emerging industries of strategic importance, the Internet of things industry consists of the support layer, the perception layer, the transfer layer, the platform layer and the application layer, mainly applied in fields like intelligen...
SAN BRUNO, Calif., March 28, 2012 /PRNewswire/ -- Aditazz was named the winner of Kaiser Permanente's "Small Hospital, Big Idea" competition. Aditazz was selected after a year-long evaluation process that concluded last week in Los Angeles when the finalists presented their designs for...
Bridgelux, Inc., a leading developer and manufacturer of LED lighting technologies and solutions, today announced the commercial availability of the new Bridgelux® Micro SM4™ surface mountable LED component that will decrease the cost and improve the performance of lighting in commerci...
SuVolta, Inc., the developer of PowerShrink™ low-power CMOS technology that cuts power consumption in ICs by 50 to 90 percent, today announced that it was named the winner of the prestigious IEEE Spectrum 2012 Emerging Technology ACE Award. During the UBM Electronics Annual Creativity ...
Rocketick Technologies LTD., a pioneer in GPU-based simulation acceleration for chip verification, will exhibit its flagship product, RocketSimTM, at the SNUG Silicon Valley Designer Community Expo in the Santa Clara Convention Center, Santa Clara, Californi...
Tom Beckley, senior vice president of Research and Development, Custom IC and Signoff, Silicon Realization Group at Cadence Design Systems, Inc, (NASDAQ: CDNS), will deliver a keynote on advanced node chip design at the International Symposium on Quality Electronic Design (ISQED). In a...
SAN JOSE, Calif., March 14, 2012 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at SEMICON China 2012 taking place in Shanghai, China from March 20 through 22.
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the latest release of Cadence® Encounter® RTL-to-GDSII flow for high-performance and giga-scale designs, including those at the latest technology node, 20 nanometers. Develope...
The 20th annual Design and Verification Conference (DVCon), sponsored by Accellera Systems Initiative, wrapped up this week with continued growth in attendance and much enthusiasm from attendees. Overall attendance rose almost 10% to 834. Exhibits were sold ...
MOUNTAIN VIEW, Calif., Feb. 28, 2012 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced that BiTMICRO Networks, a manufacturer of high-end enterprise Sol...
The 13th annual International Symposium on Quality Electronic Design (ISQED), the premier electronic design quality conference, announced its 2012 program consisting of talks by experts that cover multiple topics related to electronic design and semiconductors. The speakers and attende...
Real Intent Inc., the leading provider of software products that accelerate Early Functional Verification and Advanced Sign-Off of electronic designs, announced today that the company has joined the Cadence Design Systems Connections® program. As a result, Real Intent's SimPortal flow ...
Tensilica®, Inc. today announced that the second-generation multi-mode LTE/HSPA/3G (Long Term Evolution) baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP (digital signal processor) and the ConnX...
Tensilica®, Inc. today announced that VIA has selected Tensilica's Xtensa® dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs). After conducting a technical evaluation, VIA determined that Tensilica's DPUs provide over four times the performance ...