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Chip Design Journal

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Latest News from Chip Design Journal
Uniquify (www.uniquify.com) today signed a multi-year agreement with HashFast Technologies to design and provide silicon fabrication services for a new generation of application specific integrated circuits (ASICs) expected to dramatically increase hashing speed for Bitcoin miners.
frobas GmbH, a solution provider for implementation and verification flows in chip design, today announced that they have joined the Mentor Graphics Questa Vanguard Partnership (QVP) program. By joining the QVP program frobas adopts the advanced verification...
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that MStar Semiconductor, Inc., a leading semiconductor company for display and digital home solutions, has licensed the Tensilica® Xtensa® DPU (dataplane processor unit) for a...
SuVolta, Inc., a developer of scalable semiconductor technologies for low-power, high-performance IC chips, today announced a series of new milestones, advancing its position as a technological innovator. The achievements further validate the company's approach to solving the power pro...
IRVINE, Calif., July 22, 2013 /PRNewswire/ --
Toshiba Corporation (TOKYO:6502) today announced that it has launched a new series of high voltage MOSFETs, "πMOS VIII" series, and introduced "TK9J90E" as the initial product of the series. Mass production is scheduled to start in August, 2013.
QINGDAO, China, July 19, 2013 /PRNewswire/ -- Hisense has again kicked off a large scale recruitment roadshow across North America on July 17. Toronto, Canada will be the roads how's first stop, followed by five cities: Waterloo, Ottawa, Montreal in Canada as well as Boston and Silicon...
QINGDAO, China, July 19, 2013 /PRNewswire/ -- Hisense has again kicked off a large scale recruitment roadshow across North America on July 17. Toronto, Canada will be the roads how's first stop, followed by five cities: Waterloo, Ottawa, Montreal in Canada as well as Boston and Silicon...
Cadence Design Systems (NASDAQ: CDNS)
Summit Semiconductor, a leader in advanced wireless audio technologies, and an advisory board member of the Wireless Speaker and Audio (WiSA™) Association announce the industry's first high performance multi-channel wireless RF modules targeting the Pro-Audio market. A single Summit tr...
Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, today announced an alliance program with several design service providers in Israel. The goal of the program is to bring the ben...
MOUNTAIN VIEW, Calif., June 11, 2013 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today unveiled a new, innovative test technology to further reduce the cost of testing ...
Building upon its success in supplying chip designers access to a broad range of critical intellectual property (IP) for their latest chips, ChipEstimate.com announced today an expansion of content and resources available on its chip-planning portal. In addition to easier access to inf...
and save time and money in the process.
COLOGNE, Germany, June 4, 2013 /PRNewswire/ -- ANGA COM --
BaySand, Inc., a provider of disruptive Metal Configurable Standard Cell (MCSC) technology and products, today announced it has selected Sibridge Technologies, a provider of innovative design IPs, verification IPs, VLSI and embedded systems solutions, for th...
The 2nd to last paragraph has been updated due to a change in the quote from Indavong Vongsavady.
For 50 years, the Design Automation Conference (DAC), the premier conference devoted to electronic design, design automation, IP, embedded systems and software, has played the role of a global forum for designers and engineers from around the world. A...
IEEE, the world's largest professional organization advancing technology for humanity, today announced the publication of IEEE 1801™-2013 “Standard for Design and Verification of Low Power Integrated Circuits.” The standard, which was approved by one of the ...
IEEE, the world's largest professional organization advancing technology for humanity, today announced the launch of the IEEE Standards Association (IEEE-SA) Symposium on Electronic Design Automation (EDA) Interoperability. The event—scheduled to take place ...
IRVINE, Calif., May 29, 2013 /PRNewswire/ --
Atrenta Inc., a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries, today announced the availability of a comprehensive text book on timing constraints. The book “Constraining Designs for Synthesis an...
IRVINE, Calif., May 23, 2013 /PRNewswire/ --
Ethertronics, a leading technology company enabling innovative active antenna and RF system solutions to deliver the best connected experience, is showcasing its industry-leading, plug-and-play M2M solutions – including EtherModule 1.0™ and EtherLTE™ – this ...
CTIA WIRELESS PRE-CONFERENCE, LAS VEGAS, May 20, 2013 /PRNewswire/ --
CEA-Leti said today that Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently completed HELIOS program. The €8.5 million European Commission project developed a complete design and fa...
SUNNYVALE, CA and MOIRANS, FRANCE--(Marketwired - May 14, 2013) -  Real Intent Inc., the leading provider of software products that accelerate early functional verification and advanced sign-off of electronic designs, and DeFacTo Technologies SA, whose breakthrough technology dramatica...
SAN JOSE, Calif., May 14, 2013 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a tier-one provider and innovator of optical communications and laser solutions, today announced that it will be showcasing several new, innovative laser diode products for fiber laser, direct diode, medical an...
The Design Automation Conference (DAC), celebrating its 50th year as the premier conference devoted to electronic design, design automation, embedded systems and software, announces that Management Day will be on Tuesday, June 4, 2013. The 50th DAC wi...
Tiempo, expert in the design of secured clockless chips, has initiated the collaborative project “ASMART” with several added value partners to develop an innovative smartcard chip prototype. This chip will combine Tiempo secured clockless platform with CEA-L...
AMD (NYSE: AMD) announced today a strategic focus on developing one-of-a-kind solutions through its Semi-Custom Business Unit based on the extensive set of intellectual property (IP) amassed across AMD processors, graphics and multimedia. Providing to customers a level of flexibility a...
Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and secur...
Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards announces completion of its IP Tagging 1.0 standard. The standard provides a mechanism to ...
Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, today announced that frobas GmbH will collaborate with Atrenta on the integration of their SpyGlass® CDC clock domain crossing v...
ARMONK, N.Y., April 3, 2013 /PRNewswire/ -- IBM (NYSE: IBM) today marked the 50th anniversary of its Fellows program by elevating eight employees to IBM Fellow for their innovations in such strategic areas as cloud and mobile computing, big data and business analytics. The new Fellows ...
MUNICH and NEUBIBERG, Germany, March 28, 2013 /PRNewswire/ -- Lantiq, a leading supplier of broadband access and home networking technologies, today announced that the company has re-launched its website with improved levels of content for customers. The fresh and new design of the sit...