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Latest News from Chip Design Journal
Expanded Hardware-assisted Verification Offering Addresses Economics of Embedded Software Development and System Validation
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today extends its leading combination (combo) chip portfolio with a highly integrated global positioning system (GPS), Bluetooth(R) and FM radio solution that delivers location...
In a move aimed at helping IC design teams find the best available IP for their projects, ChipEstimate.com today announced that it has invited its user community and IP partners to begin adding customer testimonials to its online IP catalog. Members of the ChipEstimate.com community ca...
Event will feature training on Altair's ALT2150 Mobile WiMAX chipset
The International Society of Quality Electronic Design (ISQED) announced today it is now accepting exhibit and sponsorship applications from leading companies to showcase their products and services to the participants during the 10th anniversary of their ISQED'09 conference. Companies...
ChipVision Design Systems, the company whose award-winning, patented PowerOpt™ solution reduces power consumption up to 75% through system-level optimization, today announced that PowerOpt has been chosen as a finalist by the editors of EDN magazine i...
NetXen, Inc., the industry leader in 10 Gigabit Ethernet (10GbE) adapter card port shipments, today announced availability of iSCSI Boot support for its family of dual-port 10GbE and quad-port 1GbE Intelligent NIC adapters, enabling low cost SANs on ubiquito...
NetXen Inc., the market leader in 10-Gigabit Ethernet (10GbE) adapter card port shipments, today announced that it has entered 2009 with high volume production of its new line of Dual Port 10GbE and Quad Port 1GbE adapters. The products, which are based on N...
Tensilica,® Inc. today announced that UpZide Technologies AB is now an authorized Tensilica Software Design Center. Over the past three years, UpZide has worked extensively on designs with Tensilica's Xtensa® customizable processors, and has strong expertise in optimizing these process...
Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced successful completion of two complex ASIC designs. The designs, which included large numbers of integrated high-speed serializer/deserializer (S...
Bookham, Inc. (Nasdaq: BKHM), has announced a high power addition to the New Focus(TM) SWL-7500 laser portfolio. The laser is capable of delivering over 200mW of power in a narrow linewidth, stable beam, and features GaAs (gallium arsenide) chips from the Bookham facility in Zurich.
Tessera Technologies, Inc.’s (Nasdaq:TSRA) SHELLCASE® wafer-level chip-scale packaging (CSP) technology has shipped in more than one billion image sensors. The innovative technology enables low-cost, highly reliable, small form factor image sensors, making i...
Synfora, Inc., the premier provider of algorithmic synthesis tools used to design SoCs and FPGAs, today announced that it had an increase in revenues of 250 percent in calendar year 2008, and that it significantly added to its customer base. Synfora said tha...
The upcoming ISQED'09 conference will feature keynote speeches by industry leaders, 23 technical sessions with near 150 papers in three parallel tracks, panel discussions, tutorials and vendor exhibits. The conference will be held on March 16-18, at the Doubletree Hotel in San Jose, Ca...
Anova Solutions Inc., an EDA company focusing on timing and power analysis, announces its NCCM (Nonlinear Continuous Cell Model) and the new release of its cell library characterization software ChronoVA-LC for the NCCM. Fujitsu Microelectronics Limited used...
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, said today that its Cadence® Encounter® Digital Implementation System for advanced RTL-to-GDSII chip design has enabled STMicroelectronics to equip their worldwide design teams with 65- and 40- nanomet...
The Open Modeling Coalition (OMC) has released a document titled “Statistical Methods for Semiconductor Chip Design.” The document was developed by the OMC's Statistical Working Group, and is freely available to the industry on the Si2 web site link as noted...
a new online publication and portal, takes a radically new approach to providing deep insights for chip architects and engineers. Instead of pitching products, the publication focuses on issues encountered by the people who design and build them. These issues and their real-world solut...
Savant Company Inc. today announced a call for sponsors and speaker presentations for the 7th International System-on-Chip (SoC) Conference, which will be held at the Radisson Hotel Newport Beach, California, on Wednesday, November 4th, and Thursday, Novembe...
Tensilica,® Inc. today announced that over 35 companies that either license Tensilica’s popular processor cores, or use merchant market semiconductor products that include Tensilica’s cores, will be displaying products at this week’s International Consumer E...
Xceive, the market leader in worldwide multi-standard RF-to-baseband silicon tuner ICs for the digital home market, announced today that Mele, a leading manufacturer of multimedia centers, selected Xceive’s XC5000 hybrid silicon tuner for its new line of HMC...
Xceive, the market leader in worldwide multi-standard RF-to-baseband silicon tuner ICs for the digital home market, announced today that LG has selected the XC5000 silicon tuner for its new lines of high-end flat panel TVs. Xceive’s XC5000 is the first silic...
Wipro-NewLogic, the semiconductor IP business of Wipro Limited (NYSE:WIT) and the number one provider of wireless connectivity IPs, today announced the inclusion of its IEEE 1394 software stack in the Microsoft Auto platform, targeted at automotive infotainm...
Wipro-NewLogic, the semiconductor IP business of Wipro Limited (NYSE:WIT) and the number one provider of wireless connectivity IPs, today announced that GainSpan, an innovator in Wi-Fi sensor network technology, has licensed Wipro-NewLogic’s WiLD 802.11 WLAN...
In a giant leap in wireless networking technology, D-Link today announced it is preparing to ship its first 802.11n Wi-Fi router with speeds up to 450 megabits per second*. Most routers on consumer shelves today operate at 300 Mbps or less.
Tower Semiconductor Ltd. (NASDAQ: TSEM)(TASE: TSEM), a pure-play independent specialty foundry, today announced that its Board of Directors has nominated Amir Elstein to serve as the new Chairman of the Board.
Tensilica®, Inc. today announced that MegaChips Corporation, of Osaka, Japan, has become an authorized Tensilica design center. Companies needing SOC (system-on-chip) design services in Japan can take advantage of MegaChips’ expertise in the design of video ...
Xceive Corporation, the market leader in multi-standard RF-to-baseband silicon transceivers for the digital television market, PCs, and the digital home, today announced that Realtek Semiconductor Corporation, a leading supplier of networking and multimedia ...
Tela Innovations, an early-stage technology company developing a design solution to enable continued cost effective scaling of semiconductor manufacturing, today announced it has closed an additional round of financing, adding corporate investors Cadence Des...
IP Solutions to Enable Designers to Integrate Toggle-mode DDR NAND Technology Into Upcoming Computing, Networking and Portable Electronic Devices
The SOI Industry Consortium, aimed at accelerating silicon-on-insulator (SOI) innovation into broad markets, announced today that Time To Market (TTM) Inc., an ASIC design and embedded software services company based in San Jose, California has joined the SOI Industry Consortium. TTM i...
NetXen, Inc., the leader in volume 10-Gigabit Ethernet server connectivity, today launched a product evaluation program featuring its new line of Dual Port 10GbE and Quad Port 1GbE adapters, which provide industry-leading price/performance. The program gives...
NetXen, Inc., the market leader in 10 Gigabit Ethernet adapter card port shipments, today announced that it has successfully completed multi-vendor interoperability testing of Small Form Factor Pluggable (SFP+) direct attach copper products. Participants in ...
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced a new family of secure applications processors, including the world's first secure processor to integrate Trusted Platform Module (TPM) and radio frequency iden...
Samsung Semiconductor, Inc., the world leader in advanced memory technology, and Denali Software, Inc., a world-leading provider of electronic design automation (EDA) software and intellectual property (IP), have each developed an informative webinar, providing valuable insights into ...
Tensilica,® Inc. today announced that Sibridge Technologies has become an authorized Tensilica design center, supporting customers of both the Xtensa configurable processors and the Diamond Standard processor cores. Sibridge has offices in Fremont, CA, and A...
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, has launched the Cadence® Encounter® Digital Implementation System, a configurable digital implementation platform delivering incredible scalability with complete support for parallel processing across...
ASML (NASDAQ:ASML)(Amsterdam:ASML) and its subsidiary Brion Technologies today announce LithoTuner™, a new suite of products that integrates computational and wafer lithography to improve semiconductor manufacturability. LithoTuner Pattern Matcher and LithoT...
ASML and its subsidiary Brion Technologies today announce LithoTuner™, a new suite of products that integrates computational and wafer lithography to improve semiconductor manufacturability. LithoTuner Pattern Matcher and LithoTuner Pattern Matcher FullChip ...
CyOptics Inc., a leader in Indium Phosphide (InP) optical chip and component technologies, today announced that it is expanding its 10Gbps TOSA (Transmit Optical Sub-Assembly) portfolio with the introduction of CWDM TOSAs for the emerging 40GBASE-LR4 standard.